Did anyone use D2PAK and DPAK high power diodes with surface mount heatsinks from Aavid or Future electronics?

With the heat sinks mounted directly on the board and connected electrically, do they create any EMI issue?
If the power dissipation is high like 40 to 50 W, then what is the better way of cooling? the bottom cooling using thermal vias or the top cooling with standard surface mount heat sinks.

The reason that I know of that almost any packages cause EMI is because of their capacitive coupling to the heat sink from high frequency switching.I think you are going to have a hard time trying to dissipate 40 or 50 watts from a D-squared package. Maybe a few watts. Usually less than 5 or 10 watts from my experience unless you are using some strange and expensive cooling techniques.D-Paks even less watts. Choose a part with a low junction to case thermal resistance, too which is usually better.

Hi Bob thank you for the reply.
In case of D2PAK the surface mount heat sink is directly attached to the tab and is connected electrically so I think if the node has high dv/dt, it can radiate.
There may be some standard way of cooling these devices (D2PAK and DPAK), because many manufacturers have their standard product variants in these packages. For example, the ST Microelectronics 950V, 17A MOSFET STB20N95K5 in D2PAK and Cree's 1200V, 14A diode C4D10120E-ND in D2PAK are high power devices. So what would be the design of heat sinks for these devices to be used.
The surface mount heat sinks from Aavid has a thermal resistance of 3 to 4 C/W at 300 LFM.
Other people have used thermal vias on PCB and bottom cooling with heat sinks. But are there any standard ways to cool these packages.